AMD And Nvidia May Join Tesla As Customers For Samsung's New Texas Chip Facility
Yahoo Finance ·
Samsung Electronics is reportedly preparing to manufacture base dies for high-bandwidth memory chips used in AI processors for Advanced Micro Devices and Nvidia at its second facility in Texas. Citing the Maeil Business Newspaper, Reuters noted that the new plant has already secured orders for its entire planned output, with the bulk allocated to AMD. Spanning roughly 2.7 million square feet, construction is slated to begin this month, followed by equipment installation in 2029 and full production in 2030 using Samsung's advanced 2-nanometer process. Previously, Samsung secured a 16.5 billion dollar agreement with Tesla for its first Texas plant to build next-generation AI chips. In pre-market trading on Tuesday, AMD shares rose about 2.3 percent, while Nvidia stock gained approximately 1.4 percent.
AI 시장 분석
Samsung is expected to secure orders for High Bandwidth Memory (HBM) base dies for AMD and NVDA AI processors at its second Texas semiconductor plant, spanning 2.7 million square feet with mass production targeted for 2030. Following the news, AMD shares rose about 2.3% and NVDA about 1.4% in pre-market trading. Investors are focusing on the diversification of the AI semiconductor supply chain and potential benefits from the adoption of the advanced 2nm process.
상승 영향
- Semiconductors — Samsung's Texas plant is scheduled to produce HBM base dies for AMD and NVDA, raising expectations for revenue expansion in the semiconductor equipment and foundry ecosystem driven by the adoption of the advanced 2nm process.
- AI — Major AI chip designers like AMD and NVDA are diversifying their production partnerships, enhancing the stability of core AI processor component supply and accelerating related technological growth.
DYAX 전담 분석
As Samsung's new Texas plant secures major AI clients such as AMD and NVDA, expectations for revenue growth across the related semiconductor ecosystem are rising. In particular, the 2nm process and HBM base die production are key factors directly driving the demand for high-performance AI infrastructure.
Progress in capital expenditure and the confirmation of actual order contracts leading up to mass production in 2030 will be major indicators determining stock direction. Caution is required as short-term corrections could occur if risks such as plant construction delays or changes in client orders materialize.
AI가 생성한 분석으로 투자 자문이 아닙니다.
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