NVIDIA and Cisco Launch USFP Pluggable Optics to Scale Next-Gen AI Factories

Yahoo Finance ·

On October 12, 2026, NVIDIA and Cisco unveiled the Ultra-Dense Small Form Factor Pluggable, a cutting-edge 400Gb/s-per-lane optical module designed to scale AI factories efficiently. Delivering up to 12.8Tb/s of total capacity, USFP provides four times the bandwidth density and 1.3 times the power efficiency of previous 200Gb/s solutions. This breakthrough allows operators to interconnect massive computing systems within existing network footprints without adding complex network tiers. Both tech giants are collaborating with TE Connectivity and Amphenol to establish a robust multi-source hardware ecosystem.

AI 시장 분석

Nvidia and Cisco jointly announced the next-generation ultra-high-density optical module USFP for AI factory expansion. USFP supports 400Gb/s-per-lane electrical signals, quadrupling bandwidth density and improving power efficiency by 1.3 times. This technological collaboration is expected to simultaneously enhance the scalability and power efficiency of data center networks, driving the growth of the related hardware ecosystem.

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DYAX 전담 분석

The introduction of the new USFP module by Nvidia and Cisco resolves network bottlenecks in AI factories and reduces power consumption, directly translating to increased revenue for data center infrastructure companies. The massive processing capacity of up to 12.8Tb/s and improved power efficiency reduce AI deployment costs, stimulating demand for related hardware.

In a bullish scenario, expanded AI infrastructure investment could rapidly boost earnings not only for Nvidia and Cisco but also for partners like Amphenol. In a bearish scenario, delays in supply chain transitions could limit short-term benefits. Key indicators to watch are the adoption rate of USFP by large data centers and related hardware shipments.

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