Amkor Jumps on $1.5 Billion Nvidia Packaging Deal
Yahoo Finance ·
Amkor Jumps on $1.5 Billion Nvidia Packaging Deal Renato Neves, CFA Fri, July 24, 2026 at 8:42 AM EDT 1 min read AMKR NVDA TSM AMD This article first appeared on GuruFocus . Amkor Technology ( NASDAQ:AMKR ), which provides outsourced semiconductor packaging and test services, rose 9.66% premarket after announcing a $1.5 billion multi-year partnership with Nvidia ( NASDAQ:NVDA ) to develop advanced packaging and test technologies for AI and accelerated computing platforms. Nvidia will make a prepayment to fund expansion of Amkor's US capacity, centered on Arizona. The two will align long-term roadmaps on technologies including high-density interconnects and next-generation heterogeneous integration, the practice of combining different chip types in a single package. Amkor already supplies advanced packaging across Nvidia's portfolio, covering data center processors, networking chipsets and accelerated computing systems, and said the expanded arrangement will bring new technologies to market at scale. The deal follows a run of US commitments. Amkor entered a 10-year packaging partnership with TSMC ( NYSE:TSM ) in June and is working with Advanced Micro Devices ( NASDAQ:AMD ) on packaging its chips, according to Reuters. CEO Kevin Engel said the agreement "accelerates our long-term roadmap" and supports turnkey packaging and test capability in the US alongside Amkor's Asian footprint.
AI 시장 분석
Amkor Technology surged 9.66% in pre-market trading after signing a $1.5 billion multi-year advanced packaging contract with NVIDIA. NVIDIA is strengthening cooperation by providing upfront payments to expand production capacity in Arizona, USA. This contract accelerates the domestic establishment of the US AI accelerator supply chain, acting as a major tailwind for the related semiconductor ecosystem.
상승 영향
- Semiconductors — Order backlogs are surging due to the $1.5 billion advanced packaging contract with NVIDIA, driving expectations for earnings growth.
- AI — A stable packaging supply chain for AI accelerators and high-performance chips for data centers is established, accelerating infrastructure expansion.
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